Reliability Test

AEC-Q102 Test Certification Fixed Damp Heat with Humidity Cycling (FMG), LED lamp reliability test method (GB/T 33721-2017), Component screening Ammonia test CAF test, Flame retardant grade Cyclic corrosion test (CCT), Mechanical shock test, High pressure cooker test (PCT), Highly Accelerated Stress Testing (HAST), High and low temperature and humidity test (THB), Hydrogen sulfide test (H2S), Liquid tank thermal shock test (TMSK), Component humidity sensitive grade test (MSL), Screening for high reliability use Hot flash test + acoustic sweep screening for high reliability use (MSL+SAT), LED luminaires reliability test scheme, Vibration test (VVF), Temperature cycle/thermal shock test (TC/TS), LED red Ink test UV aging test, LED light source anti-vulcanization test, Double 85 constant temperature and humidity reliability environmental test (THB), Salt spray test check.

Semiconductor Chip-Car Gauge Chip

A new energy vehicle is divided into several systems, MCU belongs to the body control and vehicle system, is one of the most important systems.

MCU chips are divided into 5 levels: consumer, industrial, vehicle gauge, QJ, GJ. Among them, the car gauge chip is the current vane product. So what does the car gauge chip mean? From the name, it can be seen that the car gauge chip is the chip used in the car. Different from ordinary consumer and industrial chips, the reliability and stability of the car gauge chip is extremely important, so as to ensure the safety of the car at work.

The certification standard of the car gauge level chip is AEC-Q100, which contains four temperature levels, the smaller the number, the higher the level, the higher the requirements for the chip.

It is precisely because the requirements of the car gauge chip are so high, it is necessary to carry out a strict Burn In test before the factory, BI test requires the use of professional BI oven, our BI oven can meet the BI test of today's car gauge chip.

Connect the EMS system, so that each batch of baked chips can be traced at any time. High temperature and low temperature vacuum anaerobic environment, real-time monitoring of baking curve to ensure baking safety and effect.

Thermal Cycling Test(TC) & Thermal Shock Test(TS)

Thermal Cycling Test(TC):

In the life cycle of the product, it may face various environmental conditions, which makes the product appear in the vulnerable part, resulting in product damage or failure, and then affect the reliability of the product.

A series of high and low temperature cycling tests are done on the temperature change at the temperature variation rate of 5~15 degrees per minute, which is not a real simulation of the actual situation. Its purpose is to apply stress to the test piece, accelerate the aging factor of the test piece, so that the test piece may cause damage to the system equipment and components under environmental factors, in order to determine whether the test piece is correctly designed or manufactured.

Common ones are:

Electrical function of the product

The lubricant deteriorates and loses lubrication

Loss of mechanical strength, resulting in cracks and cracks

The deterioration of the material causes chemical action

Scope of application:

Module/system product environment simulation test

Module/System Product Strife test

PCB/PCBA/ Solder Joint Accelerated Stress Test (ALT/AST)...

Thermal Shock Test(TS):

In the life cycle of the product, it may face various environmental conditions, which makes the product appear in the vulnerable part, resulting in product damage or failure, and then affect the reliability of the product.

High and low temperature shock tests under extremely harsh conditions on rapid temperature changes at a temperature variability of 40 degrees per minute are not truly simulated. Its purpose is to apply severe stress to the test piece to accelerate the aging factor of the test piece, so that the test piece may cause potential damage to the system equipment and components under environmental factors, in order to determine whether the test piece is correctly designed or manufactured.

Common ones are:

Electrical function of the product

The product structure is damaged or the strength is reduced

Tin cracking of components

The deterioration of the material causes chemical action

Seal damage

Machine specifications:

Temperature range: -60 ° C to +150 ° C

Recovery time: < 5 minutes

Inside dimension: 370*350*330mm (D×W×H)

Scope of application:

PCB reliability acceleration test

Accelerated life test of vehicle electric module

LED parts accelerated test...

Effects of temperature changes on products:

The coating layer of components falls off, the potting materials and sealing compounds crack, even the sealing shell cracks, and the filling materials leak, which causes the electrical performance of components to decline.

Products composed of different materials, when the temperature changes, the product is not evenly heated, resulting in product deformation, sealing products cracking, glass or glassware and optics broken;

The large temperature difference makes the surface of the product condense or frost at low temperature, evaporates or melts at high temperature, and the result of such repeated action leads to and accelerates the corrosion of the product.

Environmental effects of temperature change:

Broken glass and optical equipment.

The movable part is stuck or loose.

Structure creates separation.

Electrical changes.

Electrical or mechanical failure due to rapid condensation or freezing.

Fracture in a granular or striated manner.

Different shrinkage or expansion characteristics of different materials.

The component is deformed or broken.

Cracks in surface coatings.

Air leak in the containment compartment.

Vibrational Verification for Functionality(VVF)

In the vibration generated during transportation, freight boxes are susceptible to complex dynamic pressures, and the resonant response generated is violent, which may cause packaging or product failure. Identifying the critical frequency and the type of pressure on the package will minimize this failure. Vibration testing is the assessment of the vibration resistance of components, components and complete machines in the expected transport, installation and use environment.

Common vibration modes can be divided into sinusoidal vibration and random vibration. Sinusoidal vibration is a test method often used in the laboratory, which mainly simulates the vibration generated by rotation, pulsation and oscillation, as well as the resonance frequency analysis and resonance point residence verification of the product structure. It is divided into sweep frequency vibration and fixed frequency vibration, and its severity depends on the frequency range, amplitude value and test duration. Random vibration is used to simulate the overall structural seismic strength assessment of the product and the shipping environment in the packaged state, with the severity depending on the frequency range, GRMS, test duration and axial orientation.

Vibration can not only loosen the lamp components, so that the internal relative displacement, resulting in de-welding, poor contact, poor working performance, but also make the components produce noise, wear, physical failure and even component fatigue.

To this end, Lab Companion launched a professional "LED lamp vibration test" business to simulate the vibration or mechanical shock that may occur in the actual transportation, installation and use environment of the lamp, evaluate the vibration resistance of the LED lamp and the stability of its related performance indicators, and find the weak link that may cause damage or failure. Improve the overall reliability of LED products and improve the failure status of the industry due to transportation or other mechanical shocks.

Service customers: LED lighting factory, lighting agents, lighting dealers, decoration companies

Test method:

1, the LED lamp sample packaging placed on the vibration test bench;

2, the vibration speed of the vibration tester is set to 300 RPM, the amplitude is set to 2.54 cm, start the vibration meter;

3, the lamp according to the above method in the upper and lower, left and right, front and back three directions respectively test for 30 minutes.

Results evaluation: After the vibration test, the lamp can not occur parts falling off, structural damage, lighting and other abnormal phenomena.

AEC-Q100- Failure Mechanism Based on Integrated Circuit Stress Test Certification

With the progress of automotive electronic technology, there are many complicated data management control systems in today's cars, and through many independent circuits, to transmit the required signals between each module, the system inside the car is like the "master-slave architecture" of the computer network, in the main control unit and each peripheral module, automotive electronic parts are divided into three categories. Including IC, discrete semiconductor, passive components three categories, in order to ensure that these automotive electronic components meet the highest standards of automotive anquan, the American Automotive Electronics Association (AEC, The Automotive Electronics Council is a set of standards [AEC-Q100] designed for active parts [microcontrollers and integrated circuits...] and [[AEC-Q200] designed for passive components, which specifies the product quality and reliability that must be achieved for passive parts. Aec-q100 is the vehicle reliability test standard formulated by the AEC organization, which is an important entry for 3C and IC manufacturers into the international auto factory module, and also an important technology to improve the reliability quality of Taiwan IC. In addition, the international auto factory has passed the anquan standard (ISO-26262). AEC-Q100 is the basic requirement to pass this standard.

List of automotive electronic parts required to pass AECQ-100:

Automotive disposable memory, Power Supply step-down regulator, Automotive photocoupler, three-axis accelerometer sensor, video jiema device, rectifier, ambient light sensor, non-volatile ferroelectric memory, power management IC, embedded flash memory, DC/DC regulator, Vehicle gauge network communication device, LCD driver IC, Single power Supply differential Amplifier, Capacitive proximity switch Off, high brightness LED driver, asynchronous switcher, 600V IC, GPS IC, ADAS Advanced Driver Assistance System Chip, GNSS Receiver, GNSS front-end amplifier... Let's wait.

AEC-Q100 Categories and Tests:

Description: AEC-Q100 specification 7 major categories a total of 41 tests

Group A- ACCELERATED ENVIRONMENT STRESS TESTS consists of 6 tests: PC, THB, HAST, AC, UHST, TH, TC, PTC, HTSL

Group B- ACCELERATED LIFETIME SIMULATION TESTS consists of three tests: HTOL, ELFR, and EDR

PACKAGE ASSEMBLY INTEGRITY TESTS consists of 6 tests: WBS, WBP, SD, PD, SBS, LI

Group D- DIE FABRICATION RELIABILITY Test consists of 5 TESTS: EM, TDDB, HCI, NBTI, SM

The group ELECTRICAL VERIFICATION TESTS consist of 11 tests, including TEST, FG, HBM/MM, CDM, LU, ED, CHAR, GL, EMC, SC and SER

Cluster F-Defect SCREENING TESTS: 11 tests, including: PAT, SBA

The CAVITY PACKAGE INTEGRITY TESTS consist of 8 tests, including: MS, VFV, CA, GFL, DROP, LT, DS, IWV

Short description of test items:

AC: Pressure cooker

CA: constant acceleration

CDM: electrostatic discharge charged device mode

CHAR: indicates the feature description

DROP: The package falls

DS: chip shear test

ED: Electrical distribution

EDR: non-failure-prone storage durability, data retention, working life

ELFR: Early life failure rate

EM: electromigration

EMC: Electromagnetic compatibility

FG: fault level

GFL: Coarse/fine air leakage test

GL: Gate leakage caused by thermoelectric effect

HBM: indicates the human mode of electrostatic discharge

HTSL: High temperature storage life

HTOL: High temperature working life

HCL: hot carrier injection effect

IWV: Internal hygroscopic test

LI: Pin integrity

LT: Cover plate torque test

LU: Latching effect

MM: indicates the mechanical mode of electrostatic discharge

MS: Mechanical shock

NBTI: rich bias temperature instability

PAT: Process average test

PC: Preprocessing

PD: physical size

PTC: power temperature cycle

SBA: Statistical yield analysis

SBS: tin ball shearing

SC: Short circuit feature

SD: weldability

SER: Soft error rate

SM: Stress migration

TC: temperature cycle

TDDB: Time through dielectric breakdown

TEST: Function parameters before and after stress test

TH: damp and heat without bias

THB, HAST: Temperature, humidity or high accelerated stress tests with applied bias

UHST: High acceleration stress test without bias

VFV: random vibration

WBS: welding wire cutting

WBP: welding wire tension

Temperature and humidity test conditions finishing:

THB(temperature and humidity with applied bias, according to JESD22 A101) : 85℃/85%R.H./1000h/bias

HAST(High Accelerated stress test according to JESD22 A110) : 130℃/85%R.H./96h/bias, 110℃/85%R.H./264h/bias

AC pressure cooker, according to JEDS22-A102:121 ℃/100%R.H./96h

UHST High acceleration stress test without bias, according to JEDS22-A118, equipment: HAST-S) : 110℃/85%R.H./264h

TH no bias damp heat, according to JEDS22-A101, equipment: THS) : 85℃/85%R.H./1000h

TC(temperature cycle, according to JEDS22-A104, equipment: TSK, TC) :

Level 0: -50℃←→150℃/2000cycles

Level 1: -50℃←→150℃/1000cycles

Level 2: -50℃←→150℃/500cycles

Level 3: -50℃←→125℃/500cycles

Level 4: -10℃←→105℃/500cycles

PTC(power temperature cycle, according to JEDS22-A105, equipment: TSK) :

Level 0: -40℃←→150℃/1000cycles

Level 1: -65℃←→125℃/1000cycles

Level 2 to 4: -65℃←→105℃/500cycles

HTSL(High temperature storage life, JEDS22-A103, device: OVEN) :

Plastic package parts: Grade 0:150 ℃/2000h

Grade 1:150 ℃/1000h

Grade 2 to 4:125 ℃/1000h or 150℃/5000h

Ceramic package parts: 200℃/72h

HTOL(High temperature working life, JEDS22-A108, equipment: OVEN) :

Grade 0:150 ℃/1000h

Class 1:150℃/408h or 125℃/1000h

Grade 2:125℃/408h or 105℃/1000h

Grade 3:105℃/408h or 85℃/1000h

Class 4:90℃/408h or 70℃/1000h

ELFR(Early Life failure Rate, AEC-Q100-008) : Devices that pass this stress test can be used for other stress tests, general data can be used, and tests before and after ELFR are performed under mild and high temperature conditions.

Conduction Zone of Heat

Thermal conductivity

It is the thermal conductivity of a substance, passing from high temperature to low temperature within the same substance. Also known as: thermal conductivity, thermal conductivity, thermal conductivity, heat transfer coefficient, heat transfer, thermal conductivity, thermal conductivity, thermal conductivity, thermal conductivity.

Thermal conductivity formula

k = (Q/t) *L/(A*T) k: thermal conductivity, Q: heat, t: time, L: length, A: area, T: temperature difference in SI units, the unit of thermal conductivity is W/(m*K), in imperial units, is Btu · ft/(h · ft2 · °F)

Heat transfer coefficient

In thermodynamics, mechanical engineering and chemical engineering, the heat conductivity is used to calculate the heat conduction, mainly the heat conduction of convection or the phase transformation between fluid and solid, which is defined as the heat through the unit area per unit time under the unit temperature difference, called the heat conduction coefficient of the substance, if the thickness of the mass of L, the measurement value to be multiplied by L, The resulting value is the coefficient of thermal conductivity, usually denoted as k.

Unit conversion of heat conduction coefficient

1 (CAL) = 4.186 (j), 1 (CAL/s) = 4.186 (j/s) = 4.186 (W).

The impact of high temperature on electronic products:

The rise in temperature will cause the resistance value of the resistor to decrease, but also shorten the service life of the capacitor, in addition, the high temperature will cause the transformer, the performance of the related insulation materials to decrease, the temperature is too high will also cause the solder joint alloy structure on the PCB board to change: IMC thickens, solder joints become brittle, tin whisker increases, mechanical strength decreases, junction temperature increases, the current amplification ratio of transistor increases rapidly, resulting in collector current increases, junction temperature further increases, and finally component failure.

Explanation of proper terms:

Junction Temperature: The actual temperature of a semiconductor in an electronic device. In operation, it is usually higher than the Case Temperature of the package, and the temperature difference is equal to the heat flow multiplied by the thermal resistance. Free convection (natural convection) : Radiation (radiation) : Forced Air(gas cooling) : Forced Liquid (gas cooling) : Liquid Evaporation: Surface Surroundings Surroundings

Common simple considerations for thermal design:

1 Simple and reliable cooling methods such as heat conduction, natural convection and radiation should be used to reduce costs and failures.

2 Shorten the heat transfer path as much as possible, and increase the heat exchange area.

3 When installing components, the influence of radiation heat exchange of peripheral components should be fully considered, and the thermal sensitive devices should be kept away from the heat source or find a way to use the protective measures of the heat shield to isolate the components from the heat source.

4 There should be sufficient distance between the air inlet and the exhaust port to avoid hot air reflux.

5 The temperature difference between the incoming air and the outgoing air should be less than 14 ° C.

6 It should be noted that the direction of forced ventilation and natural ventilation should be consistent as far as possible.

7 Devices with large heat should be installed as close as possible to the surface that is easy to dissipate heat (such as the inner surface of the metal casing, metal base and metal bracket, etc.), and there is good contact heat conduction between the surface.

8 Power supply part of the high-power tube and rectifier bridge pile belong to the heating device, it is best to install directly on the housing to increase the heat dissipation area. In the layout of the printed board, more copper layers should be left on the board surface around the larger power transistor to improve the heat dissipation capacity of the bottom plate.

9 When using free convection, avoid using heat sinks that are too dense.

10 The thermal design should be considered to ensure that the current carrying capacity of the wire, the diameter of the selected wire must be suitable for the conduction of the current, without causing more than the allowable temperature rise and pressure drop.

11 If the heat distribution is uniform, the spacing of the components should be uniform to make the wind flow evenly through each heat source.

12 When using forced convection cooling (fans), place the temperature-sensitive components closest to the air intake.

13 The use of free convection cooling equipment to avoid arranging other parts above the high power consumption parts, the correct approach should be uneven horizontal arrangement.

14 If the heat distribution is not uniform, the components should be sparsely arranged in the area with large heat generation, and the component layout in the area with small heat generation should be slightly denser, or add a diversion bar, so that the wind energy can effectively flow to the key heating devices.

15 The structural design principle of the air inlet: on the one hand, try to minimize its resistance to the air flow, on the other hand, consider dust prevention, and comprehensively consider the impact of the two.

16 Power consumption components should be spaced as far apart as possible.

17 Avoid crowding temperature sensitive parts together or arranging them next to high power consuming parts or hot spots.

18 The use of free convection cooling equipment to avoid arranging other parts above the high power consumption parts, the correct practice should be uneven horizontal arrangement.

Concentrator Solar Cell

A concentrating solar cell is a combination of [Concentrator Photovoltaic]+[Fresnel Lenes]+[Sun Tracker]. Its solar energy conversion efficiency can reach 31% ~ 40.7%, although the conversion efficiency is high, but due to the long sunward time, it has been used in the space industry in the past, and now it can be used in the power generation industry with sunlight tracker, which is not suitable for general families. The main material of concentrating solar cells is gallium arsenide (GaAs), that is, the three five group (III-V) materials. General silicon crystal materials can only absorb the energy of 400 ~ 1,100nm wavelength in the solar spectrum, and the concentrator is different from silicon wafer solar technology, through the multi-junction compound semiconductor can absorb a wider range of solar spectrum energy, and the current development of three-junction InGaP/GaAs/Ge concentrator solar cells can greatly improve the conversion efficiency. The three-junction concentrating solar cell can absorb energy of 300 ~ 1900nm wavelength relative to its conversion efficiency can be greatly improved, and the heat resistance of concentrating solar cells is higher than that of general wafer-type solar cells.

EC-105HTP,MTP,MTHP, High and low temperature constant temperature bath (1000L)

EC-35EXT, Superior constant temperature bath (306L)

IEC-60068-2 Combined Test of Condensation and Temperature and Humidity

Difference of IEC60068-2 damp heat test specifications

In the IEC60068-2 specification, there are a total of five kinds of humid heat tests, in addition to the common 85℃/85%R.H., 40℃/93%R.H. In addition to fixed-point high temperature and high humidity, there are two more special tests [IEC60068-2-30, IEC60068-2-38], these two are alternating wet and humid cycle and temperature and humidity combined cycle, so the test process will change temperature and humidity, and even multiple groups of program links and cycles, applied in IC semiconductors, parts, equipment, etc. To simulate the outdoor condensation phenomenon, evaluate the material's ability to prevent water and gas diffusion, and accelerate the product's tolerance to deterioration, the five specifications were organized into a comparison table of the differences in the wet and heat test specifications, and the test points were explained in detail for the wet and heat combined cycle test, and the test conditions and points of GJB in the wet and heat test were supplemented.

IEC60068-2-30 alternating humid heat cycle test

This test uses the test technique of maintaining humidity and temperature alternating to make moisture penetrate into the sample and cause condensation (condensation) on the surface of the product to be tested, so as to confirm the adaptability of the component, equipment or other products in use, transportation and storage under the combination of high humidity and temperature and humidity cyclic changes. This specification is also suitable for large test samples. If the equipment and the test process need to keep the power heating components for this test, the effect will be better than IEC60068-2-38, the high temperature used in this test has two (40 ° C, 55 ° C), the 40 ° C is to meet most of the world's high temperature environment, while 55 ° C meets all the world's high temperature environment, the test conditions are also divided into [cycle 1, cycle 2], In terms of severity, [Cycle 1] is higher than [Cycle 2].

Suitable for side products: components, equipment, various types of products to be tested

Test environment: the combination of high humidity and temperature cyclic changes produces condensation, and three kinds of environments can be tested [use, storage, transportation ([packaging is optional)]

Test stress: Breathing causes water vapor to invade

Whether power is available: Yes

Not suitable for: parts that are too light and too small

Test process and post-test inspection and observation: check the electrical changes after moisture [do not take out the intermediate inspection]

Test conditions: Humidity: 95%R.H.[Temperature change after high humidity maintenance](low temperature 25±3℃←→ high temperature 40℃ or 55℃)

Rising and cooling rate: heating (0.14℃/min), cooling (0.08 ~ 0.16℃/min)

Cycle 1: Where absorption and respiratory effects are important features, the test sample is more complex [humidity not less than 90%R.H.]

Cycle 2: In the case of less obvious absorption and respiratory effects, the test sample is simpler [humidity is not less than 80%R.H.]

IEC60068-2 damp heat test specification difference comparison table

For component type parts products, a combination test method is used to accelerate the confirmation of the test sample's resistance to degradation under high temperature, high humidity and low temperature conditions. This test method is different from the product defects caused by respiration [dew, moisture absorption] of IEC60068-2-30. The severity of this test is higher than that of other humid heat cycle tests, because there are more temperature changes and [respiration] during the test, the cycle temperature range is larger [from 55℃ to 65℃], and the temperature change rate of the temperature cycle is faster [temperature rise: 0.14 ° C /min becomes 0.38 ° C /min, 0.08 ° C /min becomes 1.16 ° C /min], in addition, different from the general humid heat cycle, the low temperature cycle condition of -10 ° C is added to accelerate the breathing rate and make the water condensed in the gap of the substitute freeze, which is the characteristic of this test specification. The test process allows the power test and the applied load power test, but it can not affect the test conditions (temperature and humidity fluctuation, rising and cooling rate) because of the heating of the side product after power. Due to the change of temperature and humidity during the test process, there can not be condensation water droplets on the top of the test chamber to the side product.

Suitable for side products: components, metal components sealing, lead end sealing

Test environment: combination of high temperature, high humidity and low temperature conditions

Test stress: accelerated breathing + frozen water

Whether it can be powered on: it can be powered on and external electric load (it can not affect the conditions of the test chamber because of power heating)

Not applicable: Can not replace moist heat and alternating humid heat, this test is used to produce defects different from respiration

Test process and post-test inspection and observation: check the electrical changes after moisture [check under high humidity conditions and take out after test]

Test conditions: damp heat cycle (25 please - 65 + 2 ℃ / 93 + / - 3% R.H.) please - low temperature cycle (25 please - 65 + 2 ℃ / 93 + 3% R.H. - - 10 + 2 ℃) X5cycle = 10 cycle

Rising and cooling rate: heating (0.38℃/min), cooling (1.16 ℃/min)

Heat and humidity cycle (25←→65±2℃/93±3%R.H.)

Low temperature cycle (25←→65±2℃/93±3%R.H. →-10±2℃)

GJB150-09 damp heat test

Instructions: The wet and heat test of GJB150-09 is to confirm the ability of equipment to withstand the influence of hot and humid atmosphere, suitable for equipment stored and used in hot and humid environments, equipment prone to high humidity, or equipment that may have potential problems related to heat and humidity. Hot and humid locations can occur throughout the year in the tropics, seasonally in mid-latitudes, and in equipment subjected to combined pressure, temperature and humidity changes, with special emphasis on 60 ° C /95%R.H. This high temperature and humidity does not occur in nature, nor does it simulate the dampness and heat effect after solar radiation, but it can find the parts of the equipment with potential problems, but it cannot reproduce the complex temperature and humidity environment, evaluate the long-term effect, and can not reproduce the humidity impact related to the low humidity environment.

Relevant equipment for condensation, wet freezing, wet heat combined cycle test: constant temperature and humidity test chamber